<mods:mods version="3.3" xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-3.xsd" xmlns:mods="http://www.loc.gov/mods/v3" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"><mods:titleInfo><mods:title>Technique and setup for diagnostics of p-n junction–package thermal resistance in high-power gallium nitride LEDs</mods:title></mods:titleInfo><mods:name type="personal"><mods:namePart type="given">V. М.</mods:namePart><mods:namePart type="family">Sorokіn</mods:namePart><mods:role><mods:roleTerm type="text">author</mods:roleTerm></mods:role></mods:name><mods:name type="personal"><mods:namePart type="given">R. V.</mods:namePart><mods:namePart type="family">Konakova</mods:namePart><mods:role><mods:roleTerm type="text">author</mods:roleTerm></mods:role></mods:name><mods:name type="personal"><mods:namePart type="given">Y. Y.</mods:namePart><mods:namePart type="family">Kudryk</mods:namePart><mods:role><mods:roleTerm type="text">author</mods:roleTerm></mods:role></mods:name><mods:name type="personal"><mods:namePart type="given">A. V.</mods:namePart><mods:namePart type="family">Zinovchuk</mods:namePart><mods:role><mods:roleTerm type="text">author</mods:roleTerm></mods:role></mods:name><mods:abstract>We present a setup and procedure of studying p-n junction–package thermal&#13;
resistance in high-power light-emitting diodes (LEDs) from their thermal relaxation. A set of&#13;
LEDs mounted on a metal-core printed circuit board (MCPCB) were studied. The contributions to the total thermal resistance from a heavy heat sink, MCPCB, heat slug and&#13;
LED chip are separated.</mods:abstract><mods:classification authority="lcc">QC Physics</mods:classification><mods:originInfo><mods:dateIssued encoding="iso8061">2012</mods:dateIssued></mods:originInfo><mods:originInfo><mods:publisher>Institute of Semiconductor Physics of Ukraine</mods:publisher></mods:originInfo><mods:genre>Article</mods:genre></mods:mods>