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	bibo:abstract "We present a setup and procedure of studying p-n junction–package thermal\r\nresistance in high-power light-emitting diodes (LEDs) from their thermal relaxation. A set of\r\nLEDs mounted on a metal-core printed circuit board (MCPCB) were studied. The contributions to the total thermal resistance from a heavy heat sink, MCPCB, heat slug and\r\nLED chip are separated."^^xsd:string;
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